Application:
-Semiconductor Industry
- Removal of oxide layers from silicon surfaces, a critical step in semiconductor fabrication.
-Display Panel Industry
- Glass thinning: HF dissolves SiO₂, making it essential for manufacturing ultra-thin glass panels.
-Steel Industry
- Surface treatment: Removes oxygen-containing impurities from stainless steel surfaces.
-Solar Energy Industry
- Wafer cleaning: Eliminates oxides and other contaminants from solar cell surfaces, ensuring high efficiency.
- Silicon wafer etching
Advantage:
- Customizable:Available in 25%, 49% and 50% to meet specific process requirements.
- Packaging options:Tank Lorry、 IBC tote、200L drum、20L pail、gallon bottle
- Metal Impurities ≤ 3 ppt
- Particle control 0.03 µm
- Precise concentration control (stable to decimal-level accuracy)