Key Applications
- Dielectric Layer Etching:BOE precisely removes SiO₂ dielectric layers while maintaining circuit integrity, essential for advanced node fabrication.
- Surface Cleaning:Effectively eliminates surface contaminants, ensuring wafer purity during processing.
Advantage:
- Customizable Formulations
- Ultra-High Purity (ppt-grade)
- Flexible Packaging:Tank Lorry、200L drum、20L pail、Gallon bottle